Extraordinary Ultra-High Resolution imaging and extremely precise nanoengineering
GAIA3 is the ideal platform for performing the most challenging nanoengineering applications that require ultimate precision and demanding capabilities for microanalysis. Preparation of high-quality ultra-thin TEM lamellae, delayering processes in technology nodes, precise nanopatterning and high-resolution 3D reconstructions are just some of the applications in which GAIA3 excels.
These features make GAIA3 the ideal instrument for applications in which imaging at low beam energies is a requirement to preserve delicate structures in samples that can get easily damaged by the electron beam such as low-k dielectric materials, photoresists or uncoated biological specimens. In terms of sample modification, GAIA3 represents the most suitable solution for challenging nanomachining and nanofabrication.

Key Features

  • A unique combination of a three-lens objective and crossover-free mode
  • Sub-nanometre resolution: 0.7 nm at 15 keV
  • Ultimate ultra-high resolution: 1 nm at 1 keV
  • New Schottky FE gun now enables beam currents up to 400 nA and rapid beam energy changes
  • Ideal solution for inspection of the latest technology nodes in advanced failure analysis processes
  • Ideal for imaging delicate biological specimens
  • Imaging of magnetic samples possible

Documents for download

GAIA3 Brochure
Extraordinary Ultra-High Resolution imaging and extremely precise nanoengineering. Download GAIA3 brochure!